HARDWARE RFP DOCUMENT 2012 Annexure I Technical Bid Group I Annexure-II_Commercial Bid Group II Annexure-II_Commercial Bid Group III Annexure-II_Commercial Bid Group IV Annexure-II_Commercial Bid Group V Annexure-II_Commercial Bid Group VI Annexure-II_Commercial Bid Annexure III Locationwise Escalation matrix Annexure IV Certficate from processor manufacturer Annexure V BG format for EMD Annexure VI MAF Annexure VII Declaration from Bidder Annexure VIII Undertaking for Quality Assurance Annexure IX Undertaking by HSSV to supply any technically qualified model Annexure X PBG format Annexure XI Authorization Document for signing of Annexures and undertakings Annexure XII Template for uploading data for PDI Annexure XIII Dowise pickschedule of buyback items Annexure XIV Consolidated report on buyback Annexure XV Undertaking for Continuous service Support Annexure XVI List of Brands of hardware components Annexure XVII Annexure for e-waste disposal Annexure XVIII Undertaking For OS compatibility for Servers Annexure XIX Format for Introductory Meeting MOM Annexure XX Undertaking for PVC-BFR Free product Annexure XXI Undertaking from printer OEM for print capacity